[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for soldering of stainless steel terminals and various plated parts, such as bimetal and nickel plating. [Applications]· Wiring/connection of electric and electronic equipment and attaching terminals. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
[Features]· Used for retrofitting and repairs of high-density printed circuit boards and in various fields of electronics.· Non-washing type. [Applications]· For retrofitting and fixing precision electric and electronic equipment. [Material]· Alloy composition: tin content ratio 60%, lead 40%
