A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%[Features]· A cost-effective lead free solder.· Uses flux with excellent wettability, keeping any drops in workability to a minimum.· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, a

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Tin/lead solder series.[Features]· Lead solder containing lead.· H-712/714/716 no-wash / RMA type.· No-wash type for micro soldering meeting minimization / refringerant elimination of fine pitch parts.· Uses an antistatic bobbin.

Lead free solder. Uses JEITA recommended alloys.[Features]· Features low-spatter flux.· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

Lead free solder. Uses JEITA recommended alloys.[Features]· Features low-spatter flux.· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

Lead free solder. Uses JEITA recommended alloys.[Features]· Features low-spatter flux.· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

Lead free solder. Uses JEITA recommended alloys.[Features]· Features low-spatter flux.· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

Lead free solder. Uses JEITA recommended alloys.[Features]· Features low-spatter flux.· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.