A file made of diamond grain with grain size of #200 attached to its substrate via electrodeposition processing.[Features]· For hard material that was previously difficult to handle.· A file with electrodeposited diamond powder used in the base material.· With a grip comfortable to hold.· Capable of deburring and chamfering ceramics, mirrors and glass not accessible to ironwork files.· Capable of maintenance of tools and the like, setting of machine tools and agricultural equipment and blades to
A file made of diamond grain with grain size of #200 attached to its substrate via electrodeposition processing.[Features]· For hard material that was previously difficult to handle.· A file with electrodeposited diamond powder used in the base material.· With a grip comfortable to hold.· Capable of deburring and chamfering ceramics, mirrors and glass not accessible to ironwork files.· Capable of maintenance of tools and the like, setting of machine tools and agricultural equipment and blades to
A file made of diamond grain with grain size of #200 attached to its substrate via electrodeposition processing.[Features]· For hard material that was previously difficult to handle.· A file with electrodeposited diamond powder used in the base material.· With a grip comfortable to hold.· Capable of deburring and chamfering ceramics, mirrors and glass not accessible to ironwork files.· Capable of maintenance of tools and the like, setting of machine tools and agricultural equipment and blades to
A file made of diamond grain with grain size of #200 attached to its substrate via electrodeposition processing.[Features]· For hard material that was previously difficult to handle.· A file with electrodeposited diamond powder used in the base material.· With a grip comfortable to hold.· Capable of deburring and chamfering ceramics, mirrors and glass not accessible to ironwork files.· Capable of maintenance of tools and the like, setting of machine tools and agricultural equipment and blades to
A file made of diamond grain with grain size of #200 attached to its substrate via electrodeposition processing.[Features]· For hard material that was previously difficult to handle.· A file with electrodeposited diamond powder used in the base material.· With a grip comfortable to hold.· Capable of deburring and chamfering ceramics, mirrors and glass not accessible to ironwork files.· Capable of maintenance of tools and the like, setting of machine tools and agricultural equipment and blades to
Urethane foam of an antistatic foreign matter removal tool.[Features]· Conductive urethane foam (rigid).· By simply inserting the IC into the foam, all terminals can be set to the same potential to prevent electrostatic interference, and the elasticity of urethane can fix the lead.· The foam can be easily cut with a cutter or scissors.[Application]· For protection of electronic components and circuit board.
Urethane foam of an antistatic foreign matter removal tool.[Features]· Conductive urethane foam (rigid).· By simply inserting the IC into the foam, all terminals can be set to the same potential to prevent electrostatic interference, and the elasticity of urethane can fix the lead.· The foam can be easily cut with a cutter or scissors.[Application]· For protection of electronic components and circuit board.
Urethane foam of an antistatic foreign matter removal tool.[Features]· Conductive urethane foam (rigid).· By simply inserting the IC into the foam, all terminals can be set to the same potential to prevent electrostatic interference, and the elasticity of urethane can fix the lead.· The foam can be easily cut with a cutter or scissors.[Application]· For protection of electronic components and circuit board.
Urethane foam of an antistatic foreign matter removal tool.[Features]· Conductive urethane foam (rigid).· By simply inserting the IC into the foam, all terminals can be set to the same potential to prevent electrostatic interference, and the elasticity of urethane can fix the lead.· The foam can be easily cut with a cutter or scissors.[Application]· For protection of electronic components and circuit board.
